Infineon and Metalink Demonstrate Industry's First Interoperable Ethernet Over Standard QAM-Based VDSL Chipsets at ITU Telecom Asia and Establish Availability of True Multi-Vendor VDSL Solutions
YAKUM, Israel and MUNICH, Germany, Dec. 2 /PRNewswire-FirstCall/ --
Metalink Ltd. (Nasdaq: MTLK), a leader in providing high-performance broadband
access chip sets, and Infineon Technologies AG (FSE/NYSE: IFX), a leading
provider of integrated circuits (ICs) for advanced communications systems
today announced that interoperability demonstrations of their respective
standards-based Ethernet over Very-high-speed Digital Subscriber Line (EoVDSL)
chipsets will be held at ITU-Telecom Asia 2002, December 2-7, Hong-Kong,
China.
Demonstrations will be held on Infineon's booth, Hall 2, #2242, and
Metalink's booth, Hall 2, #2120.
EoVDSL provides the key solution for next generation Ethernet based
broadband access over copper. A new generation of video, data and voice
services for business and residential users are made possible with EoVDSL
technology. Reaching speeds of 10-52 Mbps and more over a single telephone
line it brings a new class of broadband to the last mile.
"Amazingly enough, the average traffic in today's optical networks is less
than 33% of the potential capacity. The main reason for this is bottlenecks in
the last mile -- a problem that is easily solved by deploying VDSL," said
Christian Wolff, Vice President of Infineon's Wireline Communications Business
Group and General Manager of the Access Business Unit. "Scalability, smooth
migration from ATM to IP-based broadband solutions and fast Return On
Investment (ROI) contribute to VDSL's fast growing popularity. But the key to
VDSL growth is its ability to carry symmetric very high bit-rates and support
advanced IP-based services, namely Ethernet," added Wolff.
"Featuring the industry's first interoperable Ethernet over QAM-VDSL
solutions reinforces Infineon and Metalink's commitments, to address the
demand to accelerate mass-deployment of Ethernet broadband access, especially
in rapidly evolving markets such as China, Korea and Japan," said Tzvi
Shukhman Chairman and CEO of Metalink. "One of the key requirements of telecom
service providers to develop a widely deployed mass-market consists in
multi-vendor availability and true inter-operability. QAM VDSL has been the
only VDSL technology to address and achieve these important requirements," Mr.
Shukhman concluded.
Infineon and Metalink's Quadrature Amplitude Modulation (QAM) VDSL
chipsets are fully compliant with ETSI, ANSI (plan 997, plan 998) and the
expanded ITU VDSL standards requirements. QAM-VDSL is a robust technology
featuring high immunity to impulse and outside noise interference. It coexists
with legacy voice, ISDN, and all other legacy DSL technologies, including
ADSL. This is significantly important in highly evolved broadband markets such
as those in China, Korea and Japan where many technologies share the same
copper infrastructure. Due to its reliability it is also highly suitable for
real-time applications such as voice, interactive gaming and video.
About Metalink
Metalink, a fabless semiconductor company, develops and markets high
performance broadband access chip sets used by telecommunications and
networking equipment makers. Metalink's silicon solutions enable cost
effective, very high-speed delivery of next generation broadband access over
copper infrastructure.
Metalink's products address one of the major challenges for cost-effective
completion of an end-to-end "All-IP" Ethernet based access network by enabling
true broadband Ethernet speeds over the existing infrastructure. VDSL, the
most advanced and affordable xDSL technology, maximizes the use of available
copper capacity and provides scalable symmetric and asymmetric "Ethernet
grade" rates under all deployment scenarios in private and public networks.
Using the QAM line-code, Metalink's VDSL technology is robust and cost-
effective and ready for mass deployment.
Metalink is also a leader in the North American and International T1/E1
over Symmetric DSL transport market. Metalink's HDSL2, HDSL4 and SHDSL
solutions allow service providers to reduce the deployment costs for T1/E1
systems by reducing the need for costly repeaters used in older HDSL and T1/E1
systems.
The Company's top-level algorithmic designers, along with its leadership
in standards bodies worldwide, are establishing Metalink as a leader in the
field of broadband access.
Further information is available at www.metalinkDSL.com.
Metalink's headquarters are located at Yakum Business Park, Yakum, 60972
Israel, Tel: 972-9-9605555, Fax: 972-9-9605544. Metalink's U.S. Subsidiary is
located at 105 Lake Forest Way, Folsom, CA 95630 Tel: 916/355-1580, Fax:
916/355-1585.
About Infineon
Infineon Technologies AG, Munich, Germany, offers semiconductor and system
solutions for the automotive and industrial sectors, for applications in the
wired communications markets, secure mobile solutions as well as memory
products. With a global presence, Infineon operates in the US from San Jose,
CA, in the Asia-Pacific region from Singapore and in Japan from Tokyo. In
fiscal year 2002 (ending September), the company achieved sales of Euro 5.21
billion with about 30,400 employees worldwide. Infineon is listed on the DAX
index of the Frankfurt Stock Exchange and on the New York Stock Exchange
(ticker symbol: IFX). Further information is available at www.infineon.com.
This press release contains "forward-looking" information within the
meaning of the United States securities laws that involve risks and
uncertainties that could cause actual results to differ materially from those
in the forward looking statements. Additional factors that could cause actual
results to differ materially from these forward-looking statements are set
forth from time to time in Metalink's filings with the Securities and Exchange
Commission, including Metalink's Annual Report in Form F-20. Readers are
cautioned not to place undue reliance on forward-looking statements. The
Company undertakes no obligation to republish or revise forward-looking
statements to reflect events or circumstances after the date hereof or to
reflect the occurrences of unanticipated events. The Company cannot guarantee
future results, events, and levels of activity, performance, or achievements.
The Company does not assume a duty to update or revise any of the forward-
looking statements as a result of new information, future events or otherwise.
Make Your Opinion Count - Click Here
Source:
Metalink Ltd.; Infineon Technologies AG